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  • Linear Si Photodidode Array X-Ray Detector Boards
  • Linear Si Photodidode Array X-Ray Detector Boards
  • Linear Si Photodidode Array X-Ray Detector Boards
  • Linear Si Photodidode Array X-Ray Detector Boards

Linear Si Photodidode Array X-Ray Detector Boards

  • Based on Linear Si PD scintillation detection chips, supporting both single-energy and dual-energy X-ray detection
  • Numerous channels with custom pixel pitch and dimension
  • Common applications: security screening, non-destructive inspection, food testing, ore sensing, etc.
  • Customization for your specific application
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Specifications:

All the specifications could be customized upon requests

Capabilities of Shalom EO:

  • Silicon Photo Diode Array Detectors of 1x8, 1x16, 1x32, 1x64, 1x128, etc. pixels are available
  • Scintillator Matetials: CsI(Tl), GOS ceramic, or CdWO4


Product

SAB-6404A3

SAB-6404S3

SAB-12804

SAB-12808

SAB-LD

Model

6404A3-CG16

6404S3-CG16

6404S3-CG25

12804S-0G04

12808DV-JG08

LD04

LD08

PD type

c-si

c-si

c-si

c-si

c-si

c-si

c-si

Scintillator type

GOS+CSI

GOS+CSI

GOS+CSI

GOS

GOS+GOS

GOS

GOS

Pixel pitch

1.575mm

1.575mm

2.5mm

0.4mm

0.8mm

0.4mm

0.8mm

Energy range

30~160kV

30~320kV

30~320kV

40~160kV

40~160kV

40~160kV

40~160kV

ADC

16

16

16

16

16

16

16

Min int. time

200us

200us

200us

200us

200us

200us

200us

Speed

0.8m/s

3.0m/s

5.5m/s

2m/s

3m/s

2m/s

3m/s

Max cards

40

40

40

40&120
2link&8link core

40&120
2link&8link core

/

/

Signal trans.

GigE

GigE

GigE

GigE

GigE

GigE

GigE

Detection width

102mm

102mm

160.4mm

51.2mm

102mm

51.2*X

51.2*X


Product

SAB-6404A3

SAB-6404S3

SAB-12804

SAB-12808

SAB-LD*

Model

6404A3-CG16

6404S3-CG16

6404S3-CG25

12804S-0G04

12808DV-JG08

LD04

LD08

Baggage Inspection

 

 

 

High speed baggage

 

 

 

 

 

Car Inspection

 

 

 

 

 

Cargo Inspection

 

 

 

 

 

 

 

Security CT

 

 

 

 

 

 

 

Food Inspection

 

 

 

Mineral Sorting

 

 

 

Hangzhou Shalom EO offers a series of custom-tailored Detector Boards for X-Ray Imaging Systems. The products are x-radiation sensor chips consisting of linear Si photodiode arrays coupled with scintillators, integrated on data acquisition boards designed for x-ray line scanning. These modules feature high responsivities and short integration time, optimized NEP (noise equivalent power), etc. combined with robust architecture of high radiation resistance to ensure a long lifetime under x-ray flux and strengthened interfaces. The detector boards are apposite for applications in various fields associated with x-ray imaging and inspection, including baggage inspection, security screening, food testing, the mineral industry, etc. No matter where your interest lies Shalom EO could tailor the linear diode arrays (LDA) for incorporation into your systems to help you produce complete X-ray imaging solutions.

Each detector board produces End-Of-Scan pulses, which accommodate the aligning of individual boards into a continuous row of detector boards.

Compared to direct X-ray detection approaches, such as CCD-based detectors, the detector modules using scintillators have the advantages of a wider detectable energy range and being able to scan objects in large areas.

One layer or two layers of linearly pixelated crystalline/amorphous silicon photodiodes are coupled with scintillators on top of them. The double-layer versions allow Dual-energy Inspection, where the low-energy X-ray and high-energy X-ray are separated by the copper filter between two layers, with the pixel element numbers available like 1x8, 1x16, 1x32, 1x64, 1x128, and customized pixel dimension/pitch, all the elements are integrated simultaneously. One could also select the scintillator materials for the X-ray detectors according to specific applications. In this case, Shalom EO recommends CsI(Tl), GOS ceramic, or CdWO4, since their spectrum of high light output matches well with the sensitive spectrum of the PDs.

The scintillator x-radiation detector boards use an ROIC (readout integrated circuit) that is optimized for the specific requirements of the X-ray diode array. The printed circuit board (PCB) for the linear diode arrays is designed with components on both sides, maximizing space efficiencies and allowing for a more compact design. This allows for better signal processing, higher efficiencies, and better control over performance. A tightly integrated design reduces the number of interconnections, minimizing potential failure points and improving overall reliabilities. The detector boards support a large number of cards per single data transmission link, and multiple links can be combined, ensuring flexible operations for different scanning widths. Dedicated software provides real-time monitoring of the system, allows users to adjust operational parameters, and supports self-diagnosis for maintenance and troubleshooting. Besides, the Si PD array x-ray detector board is compatible with both Windows and Linux operating systems, ensuring easy integration into different workflows.

1.575mm pitch x 16 element Si Photodiode Coupled with GOS, CsI

1.575mm pitch x 16 element Si Photodiode Coupled with GOS, CsI

Code: SA-PD16A-16-1.575

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