The thermal imaging lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm. The distance between the measurement object and the camera can vary between 80 and 100 mm (3.15 and 3.94 in).
Important specifications
- Analysis of small chip level components down to 28 μm.
- Hands-free operation for simultaneous testing and IR imaging.
- Exchangeable, focusable thermal imaging lenses for most flexible use of the camera.
- With a Temperature resolution (NETD) of 80 mK.