Wafers and Substrates
Ceramic Substrates are substrates processed using certain kinds of ceramics engineered and designed with deliberation, which are of extensive use in the fields of aerospace, telecommunication, microwave circuits, national defense, etc. Ceramic substrates exhibit exceptional thermal conductivities, electrical insulation, superior mechanical stress, and chemical and temperature reliabilities to withstand extreme environments. Ceramic substrates are often utilized as packages or as fundamental elements for as packaging materials or as base substrates for thin-film deposition, wire bonding, and circuit printing in electronic applications. Common ceramics materials include Alumina(Al2O3) Ceramics, Aluminum Nitride (AlN), Beryllium Oxide (BeO) Ceramics, etc.
The advantages of ceramic substrates are manifold, and different ceramic materials exhibit different characteristics. Shalom EO provides bare ceramic substrates and metalized ceramic substrates made from Alumina (Aluminum Oxide) ceramics and Beryllium Oxide (Beryllia, or BeO) ceramics. Alumina ceramics are becoming the mainstream material in the electro-optic market because of their abundant availabilities, environment-friendliness, outstanding mechanical strength, chemical resistance, and finer thermal/electrical properties than normal commercial-grade ceramics. Beryllium Oxide ceramics surpass other counterpart ceramic materials in the aspect of high thermal induction. In recent years, BeO ceramics have been replaced, to a radical extent, with Alumina ceramics due to environmental issues. However, there are still quite a few contexts requiring massive thermal conduction, where the importance of BeO ceramics can not be substituted, such as high-power, large-scale integrated circuits, and armaments. The thermal conductance of Beryllia ceramics is close to those of copper and silver, which are impressive in particular and help to elevate thermal dissipation. Besides, BeO also features high melting points, excellent thermal shock resistance, and electrical insulation.
Hangzhou Shalom EO also provides silicon carbide (SiC) ceramics, the SiC ceramics that we offer are SiSiC (silicon infiltrated silicon carbide, also called siliconized SiC, reaction bonded silicon carbide/RB sic). The SiSiC ceramics that we provide are manufactured using a combination of gel casting and reaction bonding techniques, conferring our SiC ceramics with high precision and exceptional properties like minimal shrinkage (less than 1%) during the reaction bonding process, ultra-lightweight better than 10kg/m^2, and superior mechanical strength, thermal stabilities. We have succeeded in developing large-size SiC ceramic mirrors up to 4.03m. Our Sisic ceramics find versatile usage in applications like Galvo scanning mirrors, fast-steering silicon carbide mirrors, structural silicon carbide components, and semiconductor manufacturing equipment.
Hangzhou Shalom EO offers Alumina Ceramic Substrates, Bare BeO Ceramic Substrates, Thick Film Metalized BeO Ceramic Substrates, and precision SiC ceramics. The dimensions, shapes, structures, and other specifications of ceramic substrates could be custom-tailored upon inquiries. Featuring excellent electrical insulation, thermal conductance, chemical durabilities, and mechanical ruggedness, Shalom EO's ceramic substrates prove solid reliabilities in various applications including PCB, HIC, SSR, TEC, high power semiconductor modules, electrical packages, advanced optoelectric systems, etc. The Bare BeO Ceramic Substrates are fabricated using the hot-press technique, with high thermal inductance reaching a maximum of 280W/m.K. The Thick Film Metalized BeO Ceramic Substrates are manufactured using thick-film WMA/MoMn metallization with nickel electroplating, delivering great bonding force, high weldabilities, and excellent tensile strength.
